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    AMAOE Soldering Tool, CXD90060GG Positioning Plate, CXD90060GG Stencil, CXD90060GG Tin Plant, CXD90061GG Tin Plant, CXD90061GG Tin Planting Platform, CXD90061GG Planting Tin Network, CXD90062GG Positioning Plate, CXD90062GG Tin Planting Platform...

    AMAOE Soldering Tool, CXD90060GG Positioning Plate, CXD90060GG Stencil, CXD90060GG Tin Plant, CXD90061GG Tin Plant, CXD90061GG Tin Planting Platform, CXD90061GG Planting Tin Network, CXD90062GG Positioning Plate, CXD90062GG Tin Planting Platform...

    £11.99
    £11.99
    Sale Sold out
    Taxes included.
    1. Built-in magnetic base securely locks the positioning plate and dedicated middle-layer stencil.
    2. Enables rapid and precise alignment of solder pads and stencil, effectively reducing manual offset errors, improving ball placement consistency, and enhancing daily work efficiency in the repair workshop.
    3. High-temperature resistant, suitable for hot air gun reflow soldering.
    4. Employs gradient temperature hot air heating to complete solder joint reflow molding, specifically designed for Android high-end motherboard layer repair scenarios.
    5. Compact desktop design, saving repair table space.
    Specification:
    Package Weight
    One Package Weight 0.05kgs / 0.12lb
    One Package Size 10cm * 10cm * 5cm / 3.94inch * 3.94inch * 1.97inch
    Qty per Carton 240
    Carton Weight 13.00kgs / 28.66lb
    Carton Size 62cm * 52cm * 42cm / 24.41inch * 20.47inch * 16.54inch
    Loading Container 20GP: 196 cartons * 240 pcs = 47040 pcs
    40HQ: 457 cartons * 240 pcs = 109680 pcs

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